The far-IR band is uniquely suited to study the physical conditions in the interstellar medium from nearby sources out to the highest redshifts. FIR imaging and spectroscopy instrumentation using incoherent superconducting bolometers represents a high sensitivity technology for many future suborbital and space missions, including the Origins Space Telescope. Robust, high sensitivity detector arrays with several 104 pixels, large focal plane filling factors, and low cosmic ray cross sections that operate over the entire far-IR regime are required for such missions. These arrays could consist of smaller sub-arrays, in case they are tileable. The TES based Backshort Under Grid array architecture which our group has fielded in a number of FIR cameras, is a good candidate to meet these requirements: BUGs are tileable, and with the integration of the SQUID multiplexer scaleable beyond wafer sizes; they provide high filling factors, low cosmic cross section and have been demonstrated successfully in far-infrared astronomical instrumentation. However, the production of BUGs with integrated readout multiplexers has many time and resource consuming process steps. In order to meet the requirement of robustness and efficiency on the production of future arrays, we have developed a new method to provide the superconducting connection of BUG detectors to the readout multiplexers or general readout boards behind the detectors. This approach should allow us to reach the goal to produce reliable, very large detector arrays for future FIR missions.