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5 March 2018 Research on high-efficiency polishing technology of photomask substrate
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Proceedings Volume 10710, Young Scientists Forum 2017; 107102O (2018) https://doi.org/10.1117/12.2314931
Event: Young Scientists Forum 2017, 2017, Shanghai, China
Abstract
A method of photomask substrate fabrication is demonstrated ,that the surface figure and roughness of fused silica will converge to target precision rapidly with the full aperture polishing. Surface figure of optical flats in full aperture polishing processes is primarily dependent on the surface profile of polishing pad, therefor, a improved function of polishing mechanism was put forward based on two axis lapping machine and technology experience, and the pad testing based on displacement sensor and the active conditioning method of the pad is applied in this research. Moreover , the clamping deformation of the thin glass is solved by the new pitch dispensing method. The experimental results show that the surface figure of the 152mm×152mm×6.35mm optical glass is 0.25λ(λ=633nm) and the roughness is 0.32nm ,which has meet the requirements of mask substrate for 90~45nm nodes.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shijie Zhao, Ruiqing Xie, Lian Zhou, Defeng Liao, Xianhua Chen, and Jian Wang "Research on high-efficiency polishing technology of photomask substrate", Proc. SPIE 10710, Young Scientists Forum 2017, 107102O (5 March 2018); https://doi.org/10.1117/12.2314931
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