Proceedings Volume 10809 is from: Logo
SPIE PHOTOMASK TECHNOLOGY + EXTREME ULTRAVIOLET LITHOGRAPHY
17-20 September 2018
Monterey, California, United States
Front Matter: Volume 10809
Proc. SPIE 10809, Front Matter: Volume 10809, 1080901 (12 November 2018); doi: 10.1117/12.2517863
Plenary Session
Proc. SPIE 10809, Accelerate lithography improvement for high performance computing, 1080902 (3 October 2018); doi: 10.1117/12.2504658
Proc. SPIE 10809, Current challenges and opportunities for EUV lithography, 1080903 (24 October 2018); doi: 10.1117/12.2502791
EUV Scanner and Source
Proc. SPIE 10809, EUV industrialization high volume manufacturing with NXE3400B, 1080904 (3 October 2018); doi: 10.1117/12.2502785
Proc. SPIE 10809, NXE:3400B imaging performance assessed from a customer perspective, 1080905 (3 October 2018); doi: 10.1117/12.2503343
Proc. SPIE 10809, Long collector mirror lifetime demonstration around 100W average LP-EUV source for semiconductor high volume manufacturing (Conference Presentation), 1080906 (12 October 2018); doi: 10.1117/12.2502015
Proc. SPIE 10809, Accelerator-based compact extreme ultraviolet (EUV) sources for lithography, 1080907 (3 October 2018); doi: 10.1117/12.2501900
Proc. SPIE 10809, Upgrade plan of cERL for the POC as a first stage of the development on EUV-FEL high power light source (Conference Presentation), 1080908 (12 October 2018); doi: 10.1117/12.2501649
EUV Process Control
Proc. SPIE 10809, EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems, 1080909 (3 October 2018); doi: 10.1117/12.2501825
Proc. SPIE 10809, Non‐Gaussian CD distribution characterization for DRAM application in EUV lithography, 108090A (3 October 2018); doi: 10.1117/12.2501820
Proc. SPIE 10809, Measurement and modeling of diffusion characteristics in EUV resist, 108090B (3 October 2018); doi: 10.1117/12.2502226
Proc. SPIE 10809, Massive CD metrology for EUV failure characterization and EPE metrology, 108090C (3 October 2018); doi: 10.1117/12.2502495
EUV Mask Blanks: Joint Session with conferences 10809 and 10810
Proc. SPIE 10809, Cleaning durability of the applied materials EUV mask blanks (Conference Presentation), 108090E (12 October 2018); doi: 10.1117/12.2502808
Proc. SPIE 10809, Ion beam processing for critical EUV photomask process steps: mask blank deposition and photomask absorber etch, 108090F (3 October 2018); doi: 10.1117/12.2501832
Proc. SPIE 10809, Enabling enhanced EUV lithographic performance using advanced SMO, OPC, and RET, 108090G (2 January 2019); doi: 10.1117/12.2502809
EUV Materials I
Proc. SPIE 10809, Recent progress of materials and processes for EUV lithography. Ready for HVM? (Conference Presentation), 108090H (12 October 2018); doi: 10.1117/12.2501782
Proc. SPIE 10809, Pattern formation mechanism of zirconia nanoparticle resist used for extreme-ultraviolet lithography (Conference Presentation), 108090I (12 October 2018); doi: 10.1117/12.2501647
Proc. SPIE 10809, Progress in multi-trigger resists for EUV lithography (Conference Presentation), 108090K (12 October 2018); doi: 10.1117/12.2501811
Proc. SPIE 10809, Evaluation of EUV resists for 5nm technology node and beyond, 108090L (26 October 2018); doi: 10.1117/12.2502688
EUV Mask and Imaging: Joint Session with conferences 10809 and 10810
Proc. SPIE 10809, Optimization and stability of CD variability in pitch 40 nm contact holes on NXE:3300, 108090M (3 October 2018); doi: 10.1117/12.2501797
Proc. SPIE 10809, EUV pupil optimization for 32nm pitch logic structures, 108090N (3 October 2018); doi: 10.1117/12.2503321
Proc. SPIE 10809, Rapid image-based pupil plane characterization for EUV lithography systems, 108090O (9 October 2018); doi: 10.1117/12.2501863
EUV Inspection, Repair, and Verification: Joint Session with conferences 10809 and 10810
Proc. SPIE 10809, Phase defect inspection on EUV masks using RESCAN, 108090Q (15 October 2018); doi: 10.1117/12.2502726
EUV Pellicle and Metrology: Joint Session with conferences 10809 and 10810
Proc. SPIE 10809, Development of full-size EUV pellicle with thermal emission layer coating, 108090R (3 October 2018); doi: 10.1117/12.2501772
Proc. SPIE 10809, Actinic laboratory EUV tools for mask and pellicle metrology (Conference Presentation), 108090S (12 October 2018); doi: 10.1117/12.2501796
Proc. SPIE 10809, EUV mask characterization with actinic scatterometry, 108090T (3 October 2018); doi: 10.1117/12.2501970
EUV Materials II
Proc. SPIE 10809, State-of-the-art of EUV materials for N5 logic and DRAM applications, 108090U (3 October 2018); doi: 10.1117/12.2502915
Proc. SPIE 10809, Using resonant soft x-ray scattering to image patterns on undeveloped resists, 108090V (9 October 2018); doi: 10.1117/12.2502769
Proc. SPIE 10809, Advances in metal oxide resist performance and production (Conference Presentation), 108090W (12 October 2018); doi: 10.1117/12.2502958
Proc. SPIE 10809, New resist and underlayer approaches toward EUV lithography, 108090X (11 October 2018); doi: 10.1117/12.2503107
Proc. SPIE 10809, Advanced development of organic and inorganic under layers for EUV lithography (Conference Presentation), 108090Y (12 October 2018); doi: 10.1117/12.2503298
High-NA and Imaging
Proc. SPIE 10809, High-NA EUV lithography exposure tool progress (Conference Presentation), 108090Z (12 October 2018); doi: 10.1117/12.2502894
Proc. SPIE 10809, High-NA EUV lithography: The next step in EUV imaging (Conference Presentation), 1080910 (12 October 2018); doi: 10.1117/12.2502149
Proc. SPIE 10809, Berkeley MET5 update: commissioning, interferometry, and first prints (Conference Presentation), 1080911 (12 October 2018); doi: 10.1117/12.2501953
Proc. SPIE 10809, Mask 3D effects experimental measurements with NA 0.55 anamorphic imaging (Conference Presentation), 1080913 (12 October 2018); doi: 10.1117/12.2501872
Patterning
Proc. SPIE 10809, Integration via 3rd dimension: 3D power scaling, 1080914 (3 October 2018); doi: 10.1117/12.2501283
Proc. SPIE 10809, Benchmarking of EUV lithography line/space patterning versus immersion lithography multipatterning schemes at equivalent pitch, 1080915 (25 November 2018); doi: 10.1117/12.2501680
Proc. SPIE 10809, Study of resist hardmask interaction through surface activation layers, 1080916 (3 October 2018); doi: 10.1117/12.2501824
Poster Session: EUV Mask
Proc. SPIE 10809, Optimization of absorber and multilayer in EUV mask for 1D and 2D patterns , 1080919 (3 October 2018); doi: 10.1117/12.2501463
Proc. SPIE 10809, Holographic masks for computational proximity lithography with EUV radiation, 108091A (3 October 2018); doi: 10.1117/12.2502879
Proc. SPIE 10809, Extreme ultraviolet pellicle cooling by hydrogen gas flow (Conference Presentation), 108091B (7 November 2018); doi: 10.1117/12.2502731
Proc. SPIE 10809, A tool for full area inband EUV transmission mapping of EUV pellicles, 108091E (3 October 2018); doi: 10.1117/12.2501804
Proc. SPIE 10809, Pattern degradation with larger particles on EUV pellicle, 108091G (9 October 2018); doi: 10.1117/12.2502784
Proc. SPIE 10809, Defect avoidance for extreme ultraviolet mask defects using intentional pattern deformation, 108091H (9 October 2018); doi: 10.1117/12.2501525
Proc. SPIE 10809, AIMER™: full reticle area, scanner-effective EUV mapping reflectometry , 108091I (3 October 2018); doi: 10.1117/12.2501794
Poster Session: EUV Source
Proc. SPIE 10809, Operational and productization status of Adlyte’s light source for actinic patterned mask inspection HVM tools (Conference Presentation), 108091K (7 November 2018); doi: 10.1117/12.2502930
Proc. SPIE 10809, NXE:3400B EUV source performance in the field, readiness for HVM and power scaling beyond 250W, 108091L (3 October 2018); doi: 10.1117/12.2502801
Proc. SPIE 10809, Key components development progress of high-power LPP-EUV light source with unique debris mitigation system using a magnetic field, 108091M (3 October 2018); doi: 10.1117/12.2500356
Proc. SPIE 10809, Debris-free high-brightness light source based on LPP for actinic EUV microscopy and metrology applications, 108091Q (3 October 2018); doi: 10.1117/12.2501812
Proc. SPIE 10809, A possible wafer heating during EUV exposure, 108091R (11 October 2018); doi: 10.1117/12.2502918
Poster Session: Imaging/Optics
Proc. SPIE 10809, Lateral shearing interferometry for high-NA EUV wavefront metrology, 108091S (9 October 2018); doi: 10.1117/12.2501989