Front Matter: Volume 10810
Proc. SPIE 10810, Front Matter: Volume 10810, 1081001 (12 November 2018); doi: 10.1117/12.2518039
Invited Session
Proc. SPIE 10810, 2018 mask makers’ survey conducted by the eBeam Initiative, 1081002 (9 October 2018); doi: 10.1117/12.2506273
Deep Learning and Advanced Data Analytics
Proc. SPIE 10810, The self-driving photomask, 1081004 (3 October 2018); doi: 10.1117/12.2504982
Proc. SPIE 10810, Fracture time predictor in mask data preparation using machine learning, 1081005 (3 October 2018); doi: 10.1117/12.2502576
Proc. SPIE 10810, Deep learning in DFM applications (Conference Presentation), 1081006 (12 October 2018); doi: 10.1117/12.2503462
Mask Inspection, Metrology, and Repair
Proc. SPIE 10810, Minimizing tone reversal during 19x nm mask inspection: PMJ18 Best Paper (Conference Presentation), 1081007 (12 October 2018); doi: 10.1117/12.2503808
Proc. SPIE 10810, WEREWOLF: sensitivity optimization for early 7 nm EUV masks using an optical 19x nm inspection system, 1081008 (3 October 2018); doi: 10.1117/12.2502560
Proc. SPIE 10810, Ultrashort pulse laser repair of photomasks for advanced lithography technologies, 1081009 (3 October 2018); doi: 10.1117/12.2501408
Proc. SPIE 10810, Fast local registration measurements for efficient e-beam writer qualification and correction: EMLC18 Best Paper (Conference Presentation), 108100A (12 October 2018); doi: 10.1117/12.2506286
Proc. SPIE 10810, Simulation of fogging electron trajectories in a scanning electron microscope, 108100B (3 October 2018); doi: 10.1117/12.2504822
EUV Mask Blanks: Joint Session with conferences 10809 and 10810
Proc. SPIE 10810, Novel EUV mask absorber evaluation in support of next-generation EUV imaging, 108100C (10 October 2018); doi: 10.1117/12.2501799
Nanoimprint Lithography
Proc. SPIE 10810, Nanoimprint lithography and a perspective on cost of ownership, 108100E (3 October 2018); doi: 10.1117/12.2502757
Proc. SPIE 10810, High volume semiconductor manufacturing using nanoimprint lithography, 108100F (3 October 2018); doi: 10.1117/12.2501008
Proc. SPIE 10810, Sub-15nm template fabrication with multi-beam mask writer (Conference Presentation), 108100G (12 October 2018); doi: 10.1117/12.2501754
Mask Write and MPC
Proc. SPIE 10810, Multi-beam – enabling leading-edge mask writing (Conference Presentation) (Withdrawal Notice), 108100I (31 October 2018); doi: 10.1117/12.2503330
Proc. SPIE 10810, Mask process correction validation for multi-beam mask lithography, 108100K (12 November 2018); doi: 10.1117/12.2503284
Proc. SPIE 10810, Extending mask data preparation to scale to thousands of CPUs and beyond, 108100L (3 October 2018); doi: 10.1117/12.2503551
Proc. SPIE 10810, Advanced jog handling techniques in MPC for better QoR, 108100M (3 October 2018); doi: 10.1117/12.2503550
Mask Process and Resist
Proc. SPIE 10810, Design and implementation of the next generation electron beam resists for the production of EUVL photomasks, 108100N (3 October 2018); doi: 10.1117/12.2501808
Proc. SPIE 10810, Material design for the improvement of ZEP520A performance, 108100O (3 October 2018); doi: 10.1117/12.2501648
Proc. SPIE 10810, Lithographic benefits and mask manufacturability study of curvilinear masks, 108100P (22 October 2018); doi: 10.1117/12.2501973
Proc. SPIE 10810, Photomask manufacturability and pattern fidelity for curvilinear structures, 108100Q (3 October 2018); doi: 10.1117/12.2502055
Proc. SPIE 10810, Advancements in pellicle glue residue removal, 108100R (3 October 2018); doi: 10.1117/12.2503937
EUV Mask and Imaging: Joint Session with conferences 10809 and 10810
Proc. SPIE 10810, AIMSTM EUV first insertion into the back end of the line of a mask shop: a crucial step enabling EUV production, 108100S (2 January 2019); doi: 10.1117/12.2503361
Proc. SPIE 10810, Pattern shift response metrology, 108100T (8 October 2018); doi: 10.1117/12.2502353
EUV Inspection, Repair, and Verification: Joint Session with conferences 10809 and 10810
Proc. SPIE 10810, E-beam based EUV mask characterization for studying mask induced wafer effects, 108100U (18 October 2018); doi: 10.1117/12.2502588
Proc. SPIE 10810, AIMS™ EUV tool platform: aerial-image based qualification of EUV masks, 108100V (23 October 2018); doi: 10.1117/12.2501379
Proc. SPIE 10810, A high-brightness accelerator-based EUV source for metrology applications, 108100W (8 October 2018); doi: 10.1117/12.2501930
EUV Pellicle and Metrology: Joint Session with conferences 10809 and 10810
Proc. SPIE 10810, Experimental evaluation of the impact of EUV pellicles on reticle imaging, 108100Y (3 October 2018); doi: 10.1117/12.2502480
Poster Session: Mask Inspection, Metrology, and Repair
Proc. SPIE 10810, Pattern edge roughness study on OMOG mask repair, 108100Z (3 October 2018); doi: 10.1117/12.2501753
Proc. SPIE 10810, Using 3D Monte Carlo simulation to develop resists for next-generation lithography, 1081011 (3 October 2018); doi: 10.1117/12.2501813
Proc. SPIE 10810, Intra-field mask-to-mask overlay: separating the mask writing from the dynamic pellicle contribution (PMJ18 Best Poster) (Conference Presentation), 1081013 (7 November 2018); doi: 10.1117/12.2502917
Proc. SPIE 10810, Multiple beam technology development and application for defect inspection on EUV wafer/mask, 1081014 (3 October 2018); doi: 10.1117/12.2503857
Proc. SPIE 10810, Improving mask yield by implementing an advanced mask blank inspection system, 1081017 (3 October 2018); doi: 10.1117/12.2511160
Poster Session: EUV Pellicle and Metrology
Proc. SPIE 10810, EUV mask and pellicle metrology for high-volume manufacturing (Conference Presentation), 1081019 (7 November 2018); doi: 10.1117/12.2502931
Poster Session: Mask Process and Resist
Proc. SPIE 10810, 3D NTD resist deformation compact model for OPC and ILT applications, 108101A (8 October 2018); doi: 10.1117/12.2501992
Proc. SPIE 10810, A study of the TMAH based clean performance on advanced photomask, 108101B (3 October 2018); doi: 10.1117/12.2500804
Poster Session: Mask Write and MPC
Proc. SPIE 10810, Variable shaped beam lithography capabilities enhancement by "small-shots" correction, 108101D (3 October 2018); doi: 10.1117/12.2501823
Proc. SPIE 10810, 2D SRAF rule extraction for fast application based on model-based results, 108101E (3 October 2018); doi: 10.1117/12.2501455
Proc. SPIE 10810, Multiple exposure on single blank for electron-beam writer characterization, 108101G (3 October 2018); doi: 10.1117/12.2501760
Proc. SPIE 10810, Applying MPC for EUV mask fabrication, 108101H (3 October 2018); doi: 10.1117/12.2502068
Poster Session: EUV Mask Blanks
Proc. SPIE 10810, Recent bottom layered half-tone mask blanks development for large sized and high resolution flat panel displays, 108101J (3 October 2018); doi: 10.1117/12.2501511
Poster Session: Deep Learning and Advanced Analytics
Proc. SPIE 10810, Hotspot analysis and empirical correction through mask and wafer technology harmonization, 108101K (3 October 2018); doi: 10.1117/12.2501427
Proc. SPIE 10810, Automated rough line-edge estimation from SEM images using deep convolutional neural networks, 108101L (3 October 2018); doi: 10.1117/12.2501723
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