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24 July 2018 Study on the highly intelligent uniformity correction and the application for lithography
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Proceedings Volume 10827, Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018); 108272H (2018) https://doi.org/10.1117/12.2326837
Event: Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018), 2018, Shanghai, China
Abstract
The uniformity of the illumination field in the scanning direction is an important factor that affects the lithographic overlay accuracy as well as Critical dimension uniformity (CDU). With the improvement of lithography resolution illumination integrated uniformity is also increasing. To improving illumination integrated uniformity, a highly intelligent uniformity correction is introduced, which is used to correct the illumination integrated uniformity by inserting a plurality of independent movable correction plate arrays into the illumination field. In addition, a correction algorithm based on step by step is proposed. The simulation results show that the corrected illumination integrated uniformity is better than 0.3%, which is meeting the requirements of illumination integrated uniformity for 65nm node lithography.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Weilin Cheng, Fang Zhang, Dongliang Lin, Aijun Zeng, Baoxi Yang, and Huijie Huang "Study on the highly intelligent uniformity correction and the application for lithography", Proc. SPIE 10827, Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018), 108272H (24 July 2018); https://doi.org/10.1117/12.2326837
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