31 July 1989 Three Dimensional Analysis Of Volume Vibrations By Electronic Speckle Pattern Interferometry
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Proceedings Volume 1084, Stress and Vibration: Recent Developments in Industrial Measurement and Analysis; (1989) https://doi.org/10.1117/12.952923
Event: Sira/Stress and Vibration: Recent Developments in Measurement and Analysis, 1989, London, United Kingdom
Abstract
There are many situations in vibration analysis where it is necessary or desirable to make three-dimensional measurements. By using three different illumination geometries around a single imaging system, Electronic Speckle Pattern Interferometry (ESPI) can be used to measure the orthogonal components of vibration amplitude independently. These can be combined to determine the three-dimensional mode shape. The theory is given for making quantitative measurements, and a practical system is described. Examples of experimental results are presented for volume vibrations of a thick cylinder, identification of vibration modes of a turbocharger blade, and observation of in-plane modes in a thin plate.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. C. Shellabear, M. C. Shellabear, J. R . Tyrer, J. R . Tyrer, } "Three Dimensional Analysis Of Volume Vibrations By Electronic Speckle Pattern Interferometry", Proc. SPIE 1084, Stress and Vibration: Recent Developments in Industrial Measurement and Analysis, (31 July 1989); doi: 10.1117/12.952923; https://doi.org/10.1117/12.952923
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