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30 January 1989 Surface Characterization Of Aluminum Substrates Exposed To Photoresist Developers
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Surface composition of aluminized substrates after exposure to sodium silicate buffered and non-buffered alkaline developers is described. Variable angle x-ray photoelectron scattering (XPS) reveals that sodium silicate buffered alkaline developers form a protective aluminosilicate film on the wafer surface which inhibits aluminum erosion. The elemental composition and possible mechanisms of film formation are presented. Aluminum-copper alloy sputtered wafers are more susceptible to etch by non-buffered alkaline developers than non-alloyed aluminum sputtered wafers.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
K. A. Graziano, C. S. Allen, and Hua-Yu Liu "Surface Characterization Of Aluminum Substrates Exposed To Photoresist Developers", Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989);

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