19 July 1989 Characterization of Automated Wafer Inspection Tools
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With some companies now ramping up production of the 4 Mbit DRAM, the era of submicron device technology has begun. To produce each new device with an acceptable yield, there is a requirement for a decrease in defect density in comparison to previous generations of technology as shown in the figure 1.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rick Wallace, Rick Wallace, Gary Dickerson, Gary Dickerson, } "Characterization of Automated Wafer Inspection Tools", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953091; https://doi.org/10.1117/12.953091

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