Translator Disclaimer
19 July 1989 Combining Electrical Defect Monitors with Automatic Visual Inspection Systems
Author Affiliations +
Abstract
As defect densities decrease, ever increasing sample areas will be required for statistically valid estimates of defect densities. Several tools exist, such as electrical defect monitors (serpentines and combs), that can test a large area but provide little information about the defects detected. At the same time, automated visual inspection techniques (KLA 2028) exist that inspect smaller areas with greater detail. We propose a strategy for analyzing large areas with great detail by combining both of these tools. The necessity of obtaining visual information for process evaluations is discussed. Experimental results are described in support of this strategy.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christopher W. Teutsch and David C. Drain "Combining Electrical Defect Monitors with Automatic Visual Inspection Systems", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953092; https://doi.org/10.1117/12.953092
PROCEEDINGS
11 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Dynamic Statistical Process Control
Proceedings of SPIE (December 31 1987)
Extending electrical measurements to the 0.5 µm regime
Proceedings of SPIE (June 30 1991)
Wafer Inspection Technology For Submicron Devices
Proceedings of SPIE (July 18 1989)
Recent Results From A High Thruput, In-Line Metrology SEM
Proceedings of SPIE (December 31 1987)
Recent Advances In Automated Patterned Wafer Inspection
Proceedings of SPIE (July 18 1989)
Characterization of Automated Wafer Inspection Tools
Proceedings of SPIE (July 18 1989)

Back to Top