19 July 1989 Contact Window Metrology Using The Photocleave Technique
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Abstract
Application of the nondestructive Photocleave Technique for determining the shape and size of sub-micron contact windows defined in photoresist is described. Stepper-based printing in positive photoresist is assumed. Following conventional exposure of the contact windows in pass 1, the stepper is programmed to immediately execute pass 2, with an appropriate pass-shift, to expose a linear feature that sections the latent images of the contact windows. After development, a fast turn around SEM is used to determine the contact window parameters with an enhanced level of certainty as a result of using the Photocleave Technique.
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T. Yang, T. Yang, D. E. Schrope, D. E. Schrope, B. J. Dardzinski, B. J. Dardzinski, J. D. Cuthbert, J. D. Cuthbert, } "Contact Window Metrology Using The Photocleave Technique", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953080; https://doi.org/10.1117/12.953080
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