19 July 1989 Contact Window Metrology Using The Photocleave Technique
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Application of the nondestructive Photocleave Technique for determining the shape and size of sub-micron contact windows defined in photoresist is described. Stepper-based printing in positive photoresist is assumed. Following conventional exposure of the contact windows in pass 1, the stepper is programmed to immediately execute pass 2, with an appropriate pass-shift, to expose a linear feature that sections the latent images of the contact windows. After development, a fast turn around SEM is used to determine the contact window parameters with an enhanced level of certainty as a result of using the Photocleave Technique.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
T. Yang, T. Yang, D. E. Schrope, D. E. Schrope, B. J. Dardzinski, B. J. Dardzinski, J. D. Cuthbert, J. D. Cuthbert, } "Contact Window Metrology Using The Photocleave Technique", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953080; https://doi.org/10.1117/12.953080


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