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19 July 1989 Recent Advances In Automated Patterned Wafer Inspection
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Abstract
An automated patterned wafer inspection system has been developed with submicron sensitivity which is capable of inspecting a complete 150mm wafer in less than three and a half minutes. The system was designed to be used on-line in a production environment to assist the process engineer in identifying critical yield limiting process steps. The system can be interfaced to an automated off-line defect review microscope which allows for the classification of defects. An overview of the optical system and unique signal processing techniques will be presented. Performance results on a variety of different process levels on various types of patterned wafers will be discussed.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rod Browning, Ian Lincoln, and Peter Stonestrom "Recent Advances In Automated Patterned Wafer Inspection", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); https://doi.org/10.1117/12.953117
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