Paper
19 July 1989 Sub 0.5 Micron Optical Metrology
Brian Chisholm, Don Yansen, Christopher Morrill
Author Affiliations +
Abstract
Recent studies show that white light, or broadband, metrology systems continue to be used as the "work-horse" method for measuring features at 1.0 micron and below in production manufacturing environments. With the advances in the area of broadband optical metrology using sophisticated digital-image enhancement techniques, production quality measurements are now possible down to 0.5 micron and below. The purpose of this paper is to show substantial evidence that reliable, fully automatic, high speed, dynamic mode measurements can be made using optical methods on substrates in the range of 0.5 to 0.3 microns, with excellent repeatability and correlation to a SEM reference.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Brian Chisholm, Don Yansen, and Christopher Morrill "Sub 0.5 Micron Optical Metrology", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); https://doi.org/10.1117/12.953107
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Scanning electron microscopy

Metrology

Silicon

Glasses

Semiconducting wafers

Image enhancement

Inspection

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