Laser alignment systems are widely used in optical lithography for LSI production. They, especially the dark field type, have high signal-to-noise sensitivity to step height or grating line alignment marks, because of a sharp and high intensity spot owing to coherency of laser beam. The coherency often distorts alignment signals according to a little change of interference condition caused by variation of alignment marks. This phenomenon causes overlay accuracy to Al layers to deteriorate. This is because that the Al layers sometimes have a cracked or granulated rough surface and asymmetrical alignment marks which produce noise and deformed signals. In order to analyze and optimize these effects, a computer program has been developed. Laser Step Alignment (LSA) is used as a model system. With this program, it is possible to calculate the alignment signal from 3-dimensional alignment mark and resist profiles. Then, the overlay errors are analyzed from the simulated signals at various detection levels. In one optimized case, when a concave mark is used, the lower detection level should be selected to minimize the influence of Al asymmetrical coverage. This case corresponds to many experimental results.