Thermal modelling of laser diode packages

Martin Wölz; Christopher Spiess; Jan Vetterlein; Jens Meusel

doi:10.1117/12.2509579

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4 March 2019 Thermal modelling of laser diode packages

Martin Wölz; Christopher Spiess; Jan Vetterlein; Jens Meusel

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Proceedings Volume 10899, Components and Packaging for Laser Systems V; 1089905 (2019) https://doi.org/10.1117/12.2509579
Event: SPIE LASE, 2019, San Francisco, California, United States

Abstract

We introduce a toolbox for modelling laser diode operation over a large temperature range, as is encountered in long-pulse hair removal, and in mobile applications such as LiDAR. Power-to-current characteristics and lifetime estimations are sought for arbitrary pulse patterns in quasi-continuous-wave (QCW) operation. Our model is based on (1) the Z_th-representation of the package thermal transient, (2) a temperature-dependent family of diode characteristics replacing the insufficient T₀,T₁-approach, and (3) the assumption that the device lifetime depends on the maximum junction temperature. The simulated evolution of output power and temperature is experimentally verified. Using our model, we assess the influence of the package geometry on the diode temperature and on the efficiency of diode-pumped solid state lasers. We also re-assess lifetime data, and derive safe operating parameters for an arbitrary pulse length.

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Martin Wölz, Christopher Spiess, Jan Vetterlein, and Jens Meusel "Thermal modelling of laser diode packages", Proc. SPIE 10899, Components and Packaging for Laser Systems V, 1089905 (4 March 2019); https://doi.org/10.1117/12.2509579

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