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8 April 2019 Full automatic test environment for high-throughput PIC testing
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Abstract
The market of Photonic integrated circuits (PICs) has risen significantly in the previous decade. One of the major challenges to SMEs is to reduce cost and effort of packaging and pre-package testing. The PIXAPP pilot line aims to address these challenges and fill missing links in the technology chain in the context of photonics pilot manufacturing. As part of the PIXAPP pilot line, we enable time-efficient PIC characterization and validation, which is indispensable for a cost-effective manufacturing chain. A fast alignment process of optical in- and outputs to the PIC is critical to reduce the cycle times for testing. There are many underlying factors that influence achievable alignment times, such as mode field diameter, mode mismatch between waveguide and fiber, available optical power, measurement noise, the mechanical properties of the setup, controller environment, strategies used to find first light, alignment algorithms and parallelization by employing fiber arrays. We discuss a selection of these factors. Among the covered topics are the available acceleration of the mechanical axes, fiber holder stiffness, motion controller frequency and parallelization by Periscope arrays for edge coupling on the wafer scale. We demonstrate the applicability of our findings by a double sided fiber alignment in 1.7s.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Colin Dankwart, Moritz Seyfried, and Torsten Vahrenkamp "Full automatic test environment for high-throughput PIC testing", Proc. SPIE 10899, Components and Packaging for Laser Systems V, 108990N (8 April 2019); https://doi.org/10.1117/12.2511039
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