Proceedings Volume 10905 is from: Logo
2-7 February 2019
San Francisco, California, United States
Laser Processing Based on Pulse Width and Pulse Train Arrangement Techniques
Proc. SPIE 10905, Laser material processing in the ablation-cooled regime: Ablation efficiency and quality using single fs-, bursts of fs-, and single ns-pulses (Conference Presentation), 1090502 (13 March 2019); doi: 10.1117/12.2514441
Proc. SPIE 10905, Laser machining of silicon with bursts of ultra-short laser pulses: Factors influencing the process efficiency and surface quality (Conference Presentation), 1090503 (13 March 2019); doi: 10.1117/12.2513297
Proc. SPIE 10905, Influence of pulse duration in the pico- and femtosecond regime on the absorptance and specific removal rate (Conference Presentation), 1090504 (13 March 2019); doi: 10.1117/12.2511294
Direct Writing
Proc. SPIE 10905, Femtosecond laser writing of multi-level binary DOE in fused silica by slicing simulated phase distribution (Conference Presentation), 1090507 (13 March 2019); doi: 10.1117/12.2508810
Proc. SPIE 10905, Acousto-optofluidics for high-throughput laser processing (Conference Presentation), 1090508 (13 March 2019); doi: 10.1117/12.2510159
Laser Processing Based on Beam Shaping Techniques
Proc. SPIE 10905, Simulation of laser micro-machining with tunable acoustic gradient of refractive index lens (TAG lens) as an ultrafast z-scanner (Conference Presentation), 1090509 (13 March 2019); doi: 10.1117/12.2513333
Proc. SPIE 10905, Exploring the efficiency of laser materials processing with tunable acoustic gradient (TAG) lens (Conference Presentation), 109050A (13 March 2019); doi: 10.1117/12.2512960
Proc. SPIE 10905, Flexible femtosecond processing with programmable light modulators (Conference Presentation), 109050B (13 March 2019); doi: 10.1117/12.2510426
Frontier in Laser Micromachining
Proc. SPIE 10905, Laser grooving of multi stack material modeling: implementation of a high accuracy tool for laser-grooving and dicing application, 109050D (4 March 2019); doi: 10.1117/12.2504649
Proc. SPIE 10905, Modifications of surface topography by acoustic resonance induced by laser ablation with ultrashort laser pulses, 109050E (4 March 2019); doi: 10.1117/12.2508539
Proc. SPIE 10905, Selective etching of ultrafast laser modified sapphire, 109050F (4 March 2019); doi: 10.1117/12.2509415
Proc. SPIE 10905, Glass processing techniques: Mechanical versus laser-based (Conference Presentation), 109050G (13 March 2019); doi: 10.1117/12.2509328
Proc. SPIE 10905, Fused silica ablation by double femtosecond laser pulses with variable delays , 109050H (4 March 2019); doi: 10.1117/12.2509800
Proc. SPIE 10905, Ultrafast lasers for advanced manufacturing of flat panel displays, 109050I (4 March 2019); doi: 10.1117/12.2510941
Proc. SPIE 10905, Micro-processing in the ultraviolet: UV laser applications in manufacturing consumer electronics (Conference Presentation), 109050J (13 March 2019); doi: 10.1117/12.2511116
Laser-Induced Forward Transfer
Proc. SPIE 10905, Reusable laser-absorbing layers for LIFT, 109050K (4 March 2019); doi: 10.1117/12.2513012
Proc. SPIE 10905, Increasing the resolution of the Laser-Induced Forward Transfer using flow-focusing (Conference Presentation), 109050L (13 March 2019); doi: 10.1117/12.2512297
Proc. SPIE 10905, Laser-Induced Forward Transfer of silver-based pastes for metallization of photovoltaic devices, 109050M (4 March 2019); doi: 10.1117/12.2508975
Fundamental Aspects of Laser-Materials Interaction I
Proc. SPIE 10905, Study of plasma formation in solid dielectrics with the help of low-order harmonic emission, 109050O (4 March 2019); doi: 10.1117/12.2507836
Proc. SPIE 10905, Ultrafast dynamics of the photo-induced phase transition in vanadium dioxide (Conference Presentation), 109050P (13 March 2019); doi: 10.1117/12.2509646
Proc. SPIE 10905, Advanced oxide thin films produced by excimer laser-assisted metal organic compound (ELAMOD) (Conference Presentation), 109050Q (13 March 2019); doi: 10.1117/12.2511896
Proc. SPIE 10905, Third-order nonlinear optical characterization of fs-laser micromachined waveguides in Gorilla Glass (Conference Presentation), 109050R (13 March 2019); doi: 10.1117/12.2508044
Fundamental Aspects of Laser-Materials Interaction II
Proc. SPIE 10905, Nonlinear optical dynamics in femtosecond laser processing of silicon waveguides (Conference Presentation), 109050S (13 March 2019); doi: 10.1117/12.2508663
Proc. SPIE 10905, Dynamics of different ablation regimes during femtosecond laser processing of silicon (Conference Presentation), 109050T (13 March 2019); doi: 10.1117/12.2508733
Materials Synthesis and Fabrication I
Proc. SPIE 10905, Laser micro-processing of ceramic glasses by ultra-short laser pulses (Conference Presentation), 109050W (13 March 2019); doi: 10.1117/12.2514353
Proc. SPIE 10905, Laser induced crystal defects in monocrystalline silicon, 109050X (4 March 2019); doi: 10.1117/12.2508686
Proc. SPIE 10905, Low-temperature, high-concentration laser doping of 4H-SiC for low contact resistance, 109050Z (4 March 2019); doi: 10.1117/12.2509191
Materials Synthesis and Fabrication II
Proc. SPIE 10905, Fabrication of multicomponent semiconductor microspheres by laser ablation in air (Conference Presentation), 1090510 (13 March 2019); doi: 10.1117/12.2510985
Proc. SPIE 10905, Direct writing of Cu-based flexible thermal detectors using femtosecond laser-induced reduction, 1090512 (4 March 2019); doi: 10.1117/12.2507087
Nanoscale Processing
Proc. SPIE 10905, Focused laser spike (FLaSk) thermocapillary patterning of micro/nanostructures, 1090514 (4 March 2019); doi: 10.1117/12.2507662
Proc. SPIE 10905, Quantum optical lithography at 3 nm resolution (Conference Presentation), 1090515 (13 March 2019); doi: 10.1117/12.2508278
Proc. SPIE 10905, Direct laser writing of liquid metal grids for visually imperceptible stretchable electronics (Conference Presentation), 1090516 (13 March 2019); doi: 10.1117/12.2510661
Proc. SPIE 10905, Laser ablation in liquids: Fundamentals and applications (Conference Presentation), 1090517 (13 March 2019); doi: 10.1117/12.2507826
Proc. SPIE 10905, Strain sensing using electrically conductive structures composed of β-SiC fabricated by femtosecond laser direct modification of PDMS, 1090519 (4 March 2019); doi: 10.1117/12.2507088
Proc. SPIE 10905, Development of soft x-ray laser irradiation beamline for ablation and damage study, 109051C (4 March 2019); doi: 10.1117/12.2513390
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