Development of industrial scale laser micro-processing solution for mobile devices

Jie Zhang; Sha Tao; Brian Wang; Jay Zhao

doi:10.1117/12.2505910

4 March 2019 Development of industrial scale laser micro-processing solution for mobile devices

Jie Zhang, Sha Tao, Brian Wang, Jay Zhao

Proceedings Volume 10906, Laser-based Micro- and Nanoprocessing XIII; 109061A (2019) https://doi.org/10.1117/12.2505910
Event: SPIE LASE, 2019, San Francisco, California, United States

Abstract

In this paper, we will report recent progress on engineering various kinds of industrial scale laser micro-processing of PCB. FPC and glass materials used in mobile devices with ns, ps, and fs lasers, respectively. A full ps-laser processing solution of glass-based device (cover-glass, full-screen, and filter) was developed suitable for massive production. Similarly, a new processing strategy of FPC and PCB with new type of ns/ps-UV laser was also proposed for achieving good quality and high speed. Besides the well-known cutting and drilling, other processing such as coating removal using laser as an effective solution is also discussed here. In addition, the related industrialized processing modules and systems were developed.

Conference Presentation

Citation Download Citation

Jie Zhang, Sha Tao, Brian Wang, and Jay Zhao "Development of industrial scale laser micro-processing solution for mobile devices", Proc. SPIE 10906, Laser-based Micro- and Nanoprocessing XIII, 109061A (4 March 2019); https://doi.org/10.1117/12.2505910

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