Heterogeneous integration of ultra-thin atomic layer is expected to dominate future photonic and electronic devices due to their rich unique physical properties. Hence, an understanding of the role played by excitons of transition metal dichalcogenides (TMDs) is a prerequisite for achieving compact, cost-effective, efficient, fast and broadband optical modulator for advancement of optical communication. Here, we demonstrate a novel method of transferring 2D materials resembling the functionality known from printing; utilizing a combination of a sharp micro-stamper and viscoelastic polymer, we show precise placement of individual 2D materials resulting in vanishing cross-contamination to the substrate. Our 2D printer-method results in an aerial cross-contamination improvement of two to three orders of magnitude relative to state-of-the-art transfer methods from a source of average area for single flake (~50 μm2). Testing this 2D material printer on taped-out integrated Silicon photonic chips, we further demonstrate passive tunable coupling i.e. from overcoupled to undercoupled regime via critical coupling condition by integrating few layers of MoTe2 on a micro-ring resonator (MRR) for the first time which is important for active device functionality such as energy efficient modulator. Using this TMD–ring heterostructure, we further demonstrate a semi-empirical method to determine the index of the unknown TMD material near for telecommunication-relevant wavelengths. This novel approach bears further development potential to determine the index of the monolayers with high accuracy as compared to conventional methods. Such accurate and substrate-benign transfer method for 2D materials could be industrialized for rapid device prototyping due to its high time-reduction, accuracy, and contamination-free process.