Electrical-Optical PCB Technologies
Proc. SPIE 10924, Single-mode polymer waveguides and devices for high-speed on-board optical interconnect application, 1092402 (4 March 2019); doi: 10.1117/12.2511053
Proc. SPIE 10924, Erbium-doped polymer waveguide amplifiers for PCB-integrated optical links, 1092403 (4 March 2019); doi: 10.1117/12.2509983
Proc. SPIE 10924, Mode-mixing in multimode polymer waveguides for on-board optical interconnects, 1092404 (4 March 2019); doi: 10.1117/12.2510275
Proc. SPIE 10924, Large-size directly inscribed polymer waveguide device for card-to-card optical interconnect application, 1092405 (4 March 2019); doi: 10.1117/12.2509356
Optical Interconnect Devices and Modulators
Proc. SPIE 10924, Directly modulated membrane-buried heterostructure lasers on SiO2/Si substrate (Conference Presentation), 1092406 (4 March 2019); doi: 10.1117/12.2513650
Proc. SPIE 10924, Ultra-low power consumption silicon photonic link design analysis in the AIM PDK, 1092407 (4 March 2019); doi: 10.1117/12.2508514
Proc. SPIE 10924, A plasmonic optical antenna enhanced avalanche photodetector with a high gain-bandwidth product for compact lidar applications (Conference Presentation), 1092408 (4 March 2019); doi: 10.1117/12.2513803
Hybrid Integrated Optical Link Modules
Optical Interconnect Systems I
Proc. SPIE 10924, Fast optical switching technologies for inter/intra data center networks, 109240F (4 March 2019); doi: 10.1117/12.2506848
Proc. SPIE 10924, Information processing via photonic routing: residue number system arithmetic and reconfigurable graph processors (Conference Presentation), 109240G (4 March 2019); doi: 10.1117/12.2509887
Proc. SPIE 10924, Automated logic synthesis for electro-optic computing in integrated photonics, 109240H (4 March 2019); doi: 10.1117/12.2510363
Proc. SPIE 10924, Modular test system for high-speed silicon photonics transceivers, 109240I (4 March 2019); doi: 10.1117/12.2514918
Novel Optical Waveguide and Interconnect Technologies
Proc. SPIE 10924, SiN-assisted Polymer-to-SiPh adiabatic coupler optimization, 109240N (4 March 2019); doi: 10.1117/12.2510102
Proc. SPIE 10924, Evaluation of the coupling performance and long-term stability of aerosol jet printed and photolithographic manufactured waveguides for asymmetric optical bus couplers, 109240O (4 March 2019); doi: 10.1117/12.2506598
Nanophotonics for Optical Interconnects
Proc. SPIE 10924, High-speed VCSEL photonics for optical interconnects (Conference Presentation), 109240Q (4 March 2019); doi: 10.1117/12.2511312
Proc. SPIE 10924, Transfer of information using surface-plasmon-polariton waves, 109240R (4 March 2019); doi: 10.1117/12.2506456
Proc. SPIE 10924, Monolithically Integrated TCC VCSELs with Surface-normal 2D Slow-light PC Waveguide Arrays (Conference Presentation), 109240S (4 March 2019); doi: 10.1117/12.2512990
Proc. SPIE 10924, Dielectric metamaterial waveguide for optical interconnect and sensing, 109240T (19 March 2019); doi: 10.1117/12.2513817
Fiber Optics and Micro-Optics Integration
Proc. SPIE 10924, 3D laser direct writing for advanced photonic integration in optical communications, 109240U (4 March 2019); doi: 10.1117/12.2513758
Proc. SPIE 10924, Automated assembly of 127um pitched multichannel PM-fiber connectors (Conference Presentation), 109240V (4 March 2019); doi: 10.1117/12.2511258
Proc. SPIE 10924, Fiber-coupled photonic interconnects based on stacked glass block connectors, 109240W (4 March 2019); doi: 10.1117/12.2514807
Proc. SPIE 10924, Solder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities, 109240X (4 March 2019); doi: 10.1117/12.2514966
PICs for Optical Interconnects
Proc. SPIE 10924, Monolithic silicon photonic CWDM transceivers (Conference Presentation), 109240Y (4 March 2019); doi: 10.1117/12.2513775
Proc. SPIE 10924, BaTiO3-based modulators for integrated optical interconnects, 109240Z (4 March 2019); doi: 10.1117/12.2511464
Proc. SPIE 10924, MOICANA: monolithic cointegration of QD-based InP on SiN as a versatile platform for the demonstration of high-performance and low-cost PIC transmitters, 1092410 (4 March 2019); doi: 10.1117/12.2509401
Proc. SPIE 10924, High-speed energy-efficient InP photonic integrated circuit tranceivers (Conference Presentation), 1092411 (4 March 2019); doi: 10.1117/12.2515218
Proc. SPIE 10924, Generation and recombination of free carriers in silicon nano-waveguides, 1092412 (4 March 2019); doi: 10.1117/12.2513720
Hybrid Device Integration Approaches for Silicon Photonic Chips
Proc. SPIE 10924, Development of scalable optical packaging for integrated photonics (Conference Presentation), 1092413 (4 March 2019); doi: 10.1117/12.2514698
Proc. SPIE 10924, Unidirectional data center interconnects enabled by the use of broken-symmetry gap plasmon resonators (BS-GPR), 1092414 (4 March 2019); doi: 10.1117/12.2513907
Proc. SPIE 10924, Problems, challenges, and a critical survey on automated silicon photonics packaging and optical interconnection , 1092415 (4 March 2019); doi: 10.1117/12.2513593
Proc. SPIE 10924, Backside optical I/O module for Si photonics integrated with electrical ICs using fan-out wafer-level packaging technology, 1092416 (4 March 2019); doi: 10.1117/12.2504855
Proc. SPIE 10924, Polarization-insensitive glass-to-silicon photonics coupler, 1092417 (4 March 2019); doi: 10.1117/12.2510111
Poster Session
Proc. SPIE 10924, Non-Hermitian engineered single-mode laser array, 1092418 (19 March 2019); doi: 10.1117/12.2509107
Proc. SPIE 10924, Ultrafast graphene photonics for futuristic generation of datacoms, 1092419 (19 March 2019); doi: 10.1117/12.2509155
Proc. SPIE 10924, Wireless link evaluation of a dielectric resonator nanoantenna, 109241A (4 March 2019); doi: 10.1117/12.2510605
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