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Higher optical power and higher UV doses come along with a higher operation temperature of UV LED based light sources. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device and enabling higher heat dissipation. Due to the design of UV LEDs, they have to be connected to a heat spreading submount by flip chip joining. Well established processes are flip chip soldering and thermal compression bonding. However, both methods do not achieve optimal heat dissipation in practice. Solder joining material offers a thermal conductivity in the range of 50-60 W/mK which can be further reduced by voids or uncovered areas. Gold contacts for thermal compression bonding offer excellent thermal conductivity of 320 W/mK, but show a maximum coverage of 50- 70%. Silver sinter paste adapted to the UV LED contact system, is a promising alternative flip chip joining material. In order to evaluate different joining methods, UV LED devices were assembled by thermal compression bonding, diffusion bonding, soldering and sintering and compared according to, thermal resistivity, optical-electrical and mechanical behavior and reliability issues. In addition, different silver sinter pastes were tested and their thermal resistivity was adjusted via processing parameters (pressurization, sintering temperature and time). For pressureless approaches the thermal conductivity and layer thickness are in the range of solder material or below. Using pressure for sintering, several advantages will be introduced. The interconnection thickness can be adjusted to be as thin as possible (below 5 micron), which enhanced the heat dissipation. A thin sintered layer of a few microns shows a lower shrinkage and a better adhesion to the joining partners. The thermal conductivity can be enhanced as well. After sintering, the silver interconnection layer is thermally stable up to 800 °C. These facts speak for sintering pastes as a real alternative for UV LED assembly.
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