PROCEEDINGS VOLUME 10959
SPIE ADVANCED LITHOGRAPHY | 24-28 FEBRUARY 2019
Metrology, Inspection, and Process Control for Microlithography XXXIII
Proceedings Volume 10959 is from: Logo
SPIE ADVANCED LITHOGRAPHY
24-28 February 2019
San Jose, California, United States
Front Matter: Volume 10959
Proc. SPIE 10959, Front Matter: Volume 10959, 1095901 (22 May 2019); doi: 10.1117/12.2532423
Keynote Session
Proc. SPIE 10959, Tough road ahead for device overlay and edge placement error, 1095902 (26 March 2019); doi: 10.1117/12.2514820
Proc. SPIE 10959, Silicon-based quantum computing: manufacturing and metrology challenges (Conference Presentation), 1095903 (26 March 2019); doi: 10.1117/12.2517365
Overlay News
Proc. SPIE 10959, On device EPE: minimizing overlay, pattern placement, and pitch-walk, in presence of EUV stochastics and etch variations (Conference Presentation), 1095904 (26 March 2019); doi: 10.1117/12.2517284
Proc. SPIE 10959, Overlay error investigation for metal containing resist (MCR) , 1095905 (26 March 2019); doi: 10.1117/12.2516154
Proc. SPIE 10959, Process drift compensation by tunable wavelength homing in scatterometry-based overlay, 1095906 (26 March 2019); doi: 10.1117/12.2514548
Proc. SPIE 10959, Measuring after etch overlay and characterizing tilt fingerprints in multi-tier 3D-NAND structures, 1095907 (26 March 2019); doi: 10.1117/12.2515299
Proc. SPIE 10959, Standalone alignment technology enabling feed-forward compensation of on-product overlay errors, 1095908 (26 March 2019); doi: 10.1117/12.2514777
Challenges and New Methods
Proc. SPIE 10959, Machine learning and hybrid metrology using scatterometry and LE-XRF to detect voids in copper lines (Conference Presentation), 109590A (26 March 2019); doi: 10.1117/12.2515257
Proc. SPIE 10959, Image quality enhancement of a CD-SEM image using conditional generative adversarial networks, 109590B (26 March 2019); doi: 10.1117/12.2515152
Proc. SPIE 10959, Statistical significance of STEM based metrology on advanced 3D transistor structures , 109590C (26 March 2019); doi: 10.1117/12.2514963
Proc. SPIE 10959, Edge placement error measurement in lithography process with die to database algorithm, 109590D (11 April 2019); doi: 10.1117/12.2515143
Inspection I
Proc. SPIE 10959, Machine learning for predictive electrical performance using OCD, 109590F (26 March 2019); doi: 10.1117/12.2515806
Proc. SPIE 10959, Variable-wavelength tabletop-scale EUV ptychographic complex imaging reflectometry for 3D composition determination (Conference Presentation), 109590G (26 March 2019); doi: 10.1117/12.2516827
Proc. SPIE 10959, E-beam inspection of single exposure EUV direct print of M2 layer of N10 node test vehicle, 109590H (26 March 2019); doi: 10.1117/12.2515809
Proc. SPIE 10959, Gas-enhanced PFIB surface preparation enabled metrology and statistical analysis of 3D NAND devices, 109590I (26 March 2019); doi: 10.1117/12.2515069
Proc. SPIE 10959, Development of standard samples with programmed defects for evaluation of pattern inspection tools, 109590J (26 March 2019); doi: 10.1117/12.2514897
Advances in Physical Characterization
Proc. SPIE 10959, Latent imaging of resists via resonant x-ray scattering: unraveling the effects of chain scission to chemical amplification (Conference Presentation), 109590K (26 March 2019); doi: 10.1117/12.2515166
Proc. SPIE 10959, Improved sub-surface AFM using photothermal actuation (Conference Presentation), 109590L (26 March 2019); doi: 10.1117/12.2515441
Proc. SPIE 10959, Quantitative tomography with subsurface scanning ultrasound resonance force microscopy, 109590M (2 April 2019); doi: 10.1117/12.2515048
Proc. SPIE 10959, Full structure transistor process monitoring of boron and germanium in PFET EPI using in-line XPS, 109590N (23 May 2019); doi: 10.1117/12.2515266
Proc. SPIE 10959, Nano-scale molecular analysis of photo-resist films with massive cluster secondary ion mass spectrometry, 109590O (26 March 2019); doi: 10.1117/12.2515367
LWR
Proc. SPIE 10959, Unbiased roughness measurements: subtracting out SEM effects, part 3, 109590P (26 March 2019); doi: 10.1117/12.2515898
Proc. SPIE 10959, Linewidth and roughness measurement of SAOP by using FIB and Planer-TEM as reference metrology, 109590Q (26 March 2019); doi: 10.1117/12.2515989
Proc. SPIE 10959, Using critical-dimension grazing-incidence small angle x-ray scattering to study line edge roughness (Conference Presentation), 109590R (26 March 2019); doi: 10.1117/12.2514954
Proc. SPIE 10959, LER and LWR measurements used for monitoring wiggling and stochastic-failure (Conference Presentation), 109590S (26 March 2019); doi: 10.1117/12.2515803
Proc. SPIE 10959, Roughness decomposition: an on-wafer methodology to discriminate mask, metrology, and shot noise contributions, 109590T (26 March 2019); doi: 10.1117/12.2515175
New Methods: Student Session
Proc. SPIE 10959, Application of PSD for the extraction of programmed line roughness from SAXS , 109590U (26 March 2019); doi: 10.1117/12.2514919
Proc. SPIE 10959, Surface effects in simulations of scanning electron microscopy images, 109590V (26 March 2019); doi: 10.1117/12.2514824
Proc. SPIE 10959, Progress on sub-wavelength nanoimaging with a coherent tabletop EUV source (Conference Presentation), 109590W (26 March 2019); doi: 10.1117/12.2517026
Proc. SPIE 10959, Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes, 109590X (26 March 2019); doi: 10.1117/12.2514748
Proc. SPIE 10959, Tilted beam SEM, 3D metrology for industry, 109590Y (26 March 2019); doi: 10.1117/12.2514977
Machine Learning
Proc. SPIE 10959, Applications of machine learning at the limits of form-dependent scattering for defect metrology, 109590Z (26 March 2019); doi: 10.1117/12.2517285
Proc. SPIE 10959, Engineering neural networks for improved defect detection and classification, 1095910 (26 March 2019); doi: 10.1117/12.2515065
Proc. SPIE 10959, Using Gaussian process regression for efficient parameter reconstruction, 1095911 (26 March 2019); doi: 10.1117/12.2513268
Proc. SPIE 10959, Deep learning's impact on contour extraction for design based metrology and design based inspection, 1095912 (26 March 2019); doi: 10.1117/12.2514898
Proc. SPIE 10959, OPC model accuracy study using high volume contour based gauges and deep learning on memory device, 1095913 (26 March 2019); doi: 10.1117/12.2515274
SEM
Proc. SPIE 10959, What is prevalent CD-SEM's role in EUV era?, 1095914 (29 March 2019); doi: 10.1117/12.2514697
Proc. SPIE 10959, High voltage CD-SEM based metrology for 3D-profile measurement using depth-correlated BSE signal , 1095915 (26 March 2019); doi: 10.1117/12.2511272
Proc. SPIE 10959, Deep-learning-based SEM image denoiser (Conference Presentation), 1095916 (26 March 2019); doi: 10.1117/12.2515182
Proc. SPIE 10959, FEM simulation for artificial generation of SEM pictures, 1095918 (26 March 2019); doi: 10.1117/12.2515181
SEM and e-Beam Metrology
Proc. SPIE 10959, 3D-SEM challenges: How can we profile in-die 3D geometry of the integrated circuits? (Conference Presentation), 1095919 (26 March 2019); doi: 10.1117/12.2514944
Proc. SPIE 10959, Investigating process variability at ppm level using advanced massive eBeam CD metrology and contour analysis, 109591A (26 March 2019); doi: 10.1117/12.2515242
Proc. SPIE 10959, Depth measurement technique for extremely deep holes using back-scattered electron images with high voltage CD-SEM , 109591B (26 March 2019); doi: 10.1117/12.2514799
Proc. SPIE 10959, Evaluation of the accuracy and precision of STEM and EDS metrology on horizontal GAA nanowire devices, 109591C (26 March 2019); doi: 10.1117/12.2514995
Proc. SPIE 10959, High-resolution low-shrinkage CD metrology for EUV resist using high voltage CD-SEM, 109591D (26 March 2019); doi: 10.1117/12.2514797
Overlay
Proc. SPIE 10959, Improved accuracy and robustness for advanced DRAM with tunable multi-wavelength imaging and scatterometry overlay metrology, 109591E (26 March 2019); doi: 10.1117/12.2515015
Proc. SPIE 10959, Edge placement error and line edge roughness, 109591F (26 March 2019); doi: 10.1117/12.2523419