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26 March 2019 Standalone alignment technology enabling feed-forward compensation of on-product overlay errors
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A standalone alignment technology was developed as a fundamental solution to improve on-product overlay (OPO). It enables high performance alignment measurements, and delivers state-of-the-art feed-forward corrections to exposure scanners. Dense alignment sampling and high order alignment correction is effective for scanner fingerprint matching and for correcting heavy distortion at a wafer edge. A mark asymmetry correction is detailed as effective solution which improves the OPO performance for heavily processed wafers. An OPO test result showed significant improvement using its feed-forward corrections. A high accuracy topography sensor is described as a new metrology innovation. The standalone alignment technology provides critical metrology tool functions such as process monitoring as well.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takehisa Yahiro, Junpei Sawamura, Sonyong Song, Sayuri Tanaka, Yuji Shiba, Satoshi Ando, Hiroyuki Nagayoshi, Jun Ishikawa, Masahiro Morita, and Yuichi Shibazaki "Standalone alignment technology enabling feed-forward compensation of on-product overlay errors", Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 1095908 (26 March 2019);

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