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26 March 2019 Standalone alignment technology enabling feed-forward compensation of on-product overlay errors
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Abstract
A standalone alignment technology was developed as a fundamental solution to improve on-product overlay (OPO). It enables high performance alignment measurements, and delivers state-of-the-art feed-forward corrections to exposure scanners. Dense alignment sampling and high order alignment correction is effective for scanner fingerprint matching and for correcting heavy distortion at a wafer edge. A mark asymmetry correction is detailed as effective solution which improves the OPO performance for heavily processed wafers. An OPO test result showed significant improvement using its feed-forward corrections. A high accuracy topography sensor is described as a new metrology innovation. The standalone alignment technology provides critical metrology tool functions such as process monitoring as well.
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Takehisa Yahiro, Junpei Sawamura, Sonyong Song, Sayuri Tanaka, Yuji Shiba, Satoshi Ando, Hiroyuki Nagayoshi, Jun Ishikawa, Masahiro Morita, and Yuichi Shibazaki "Standalone alignment technology enabling feed-forward compensation of on-product overlay errors", Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 1095908 (26 March 2019); https://doi.org/10.1117/12.2514777
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