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23 May 2019 Full structure transistor process monitoring of boron and germanium in PFET EPI using in-line XPS
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Abstract
The epitaxial growth of source/drain structures demands a process with tight control of boron and germanium composition to ensure consistent device performance. However, in-line monitoring of the epitaxial composition in FINFET structures has been one of the most difficult challenges for both process development and manufacturing. Traditional in-line monitoring schemes have relied heavily on critical dimension (CD) measurements, with no composition information. Instead, composition information was provided by offline analysis techniques such as secondary ion mass spectrometry (SIMS), which is destructive and does not measure the composition directly on the FinFET device structure. In this paper, we present results from in-line X-Ray Photoelectron Spectroscopy (XPS) measurements on FinFET structures. This technique is not only sensitive to individual element abundance but also gives information related to the local chemical environment. For this application we monitored silicon, germanium, and boron concentrations in SiGeB EPI source/drain 3D structure without interference from other structural features in the logic device. The in-line XPS measurement of PFET EPI boron and germanium performed in this way on the full structure transistor has been demonstrated to correlate with CMOS device performance, thus significantly reducing time to detect epitaxial composition drift or excursion.
Conference Presentation
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Jusang Lee, Ganesh Subramanian, Manasa Medikonda, Hossam Lazkani, Judson Holt, Churamani Gaire, Paul Isbester, and Mark Klare "Full structure transistor process monitoring of boron and germanium in PFET EPI using in-line XPS", Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109590N (23 May 2019); https://doi.org/10.1117/12.2515266
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