In the last few years, advancements made in cameras technology, optically-based systems, and computer-aided methods have made three-dimensional digital image correlation (3D-DIC) a robust tool for structural health monitoring (SHM) and extracting structural deformations and geometry profiles. To perform 3D-DIC measurements, the position of cameras relative to each other must be determined. It is achieved by taking several pictures of calibration objects to determine the camera’s extrinsic parameters (i.e., separation distance and orientation in space). This practice can be very cumbersome and cameras calibration difficult to perform for large-sized structures. This is especially true if data is to be acquired from multiple fields of view. This study describes the design of a MEMS-based sensor board to extend 3D-DIC’s capability and allow for easier calibration and measurement. The suggested system relies on a MEMS-based Inertial Measurement Unit (IMU) for determining the spatial orientation of the cameras (i.e., roll, pitch, and yaw angles) and a 77 GHz radar sensor for measuring the relative distance of the stereo cameras. Both systems are integrated on a commercially available microcontroller unit (MCU) that makes the system suitable for low-power applications. In this research, the efforts for programming the sensor board and the performance of the combined IMU-radar system in comparison with traditional instrumentation are described. To finish, the system is used for calculating the extrinsic parameters of a stereophotogrammetry system and results are compared with data obtained from a traditional calibration.
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