Multiscale additive manufacturing of electronics and biomedical devices

Yong Lin Kong

doi:10.1117/12.2519205

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13 May 2019 Multiscale additive manufacturing of electronics and biomedical devices

Yong Lin Kong

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Proceedings Volume 10982, Micro- and Nanotechnology Sensors, Systems, and Applications XI; 109820C (2019) https://doi.org/10.1117/12.2519205
Event: SPIE Defense + Commercial Sensing, 2019, Baltimore, Maryland, United States

Abstract

Recent advances in 3D printing have enabled the creation of novel 3D constructs and devices with an unprecedented level of complexity, properties, and functionalities. In contrast to manufacturing techniques developed for mass production, 3D printing encompasses a broad class of fabrication technologies that can enable 1) the creation of highly customized and optimized 3D physical architectures from digital designs; 2) the synergistic integration of properties and functionalities of distinct classes of materials to create novel hybrid devices; and 3) a biocompatible fabrication approach that facilitates the creation and co-integration of biological constructs and systems. Developing the ability to 3D print various classes of materials possessing distinct properties could enable the freeform generation of active electronics in unique functional, interwoven architectures. Here we are developing a multiscale 3D printing approach that enables the integration of diverse classes of materials to create a variety of 3D printed electronics and functional devices with active properties that are not easily achieved using standard microfabrication techniques. In one of the examples, we demonstrate an approach to prolong the gastric residence of wireless electronics to weeks via multi-material three-dimensional design and fabrication. The surgical-free approach to integrate biomedical electronics with the human body can revolutionize telemedicine by enabling a real-time diagnosis and delivery of therapeutic agents.

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Yong Lin Kong "Multiscale additive manufacturing of electronics and biomedical devices", Proc. SPIE 10982, Micro- and Nanotechnology Sensors, Systems, and Applications XI, 109820C (13 May 2019); https://doi.org/10.1117/12.2519205

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