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14 February 2019 High efficiency silicon-on-insulator fiber-chip spot size converting edge coupler
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Proceedings Volume 11048, 17th International Conference on Optical Communications and Networks (ICOCN2018); 1104833 (2019) https://doi.org/10.1117/12.2521765
Event: 17th International Conference on Optical Communications and Networks (ICOCN2018), 2018, Zhuhai, China
Abstract
A fiber-chip spot size converting edge coupler has been presented on silicon-on-insulator (SOI) platform. The design is optimized for the wavelength of 1.55 μm using a fully-vectorial three-dimensional eigenmode expansion method. The proposed coupler combines an inverse taper edge coupler and a mode expander on a 220-nm-thick SOI platform. Results show that our proposed coupler could achieve an output profile of 10.4 μm×220 nm and 90% coupling efficiency operating for both transverse-electric and transverse-magnetic polarizations.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bo Liu, Gang Yang, Smit Desai, Keith Powell, Walter Xie, Liwei Li, and Xiaoke Yi "High efficiency silicon-on-insulator fiber-chip spot size converting edge coupler", Proc. SPIE 11048, 17th International Conference on Optical Communications and Networks (ICOCN2018), 1104833 (14 February 2019); https://doi.org/10.1117/12.2521765
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