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21 June 2019 Sensitivity of an image-plane digital holography interferometer for the measurement of pile-up
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Abstract
The accurate determination of the contact area between an instrumented indenter and the material under testing is important for material property measurements. Usually, it is masked by the pile-up or sink-in phenomenon. Due to the wide range of materials available in the industry, different amounts of pile-up would be generated depending on the grade of fragility of the material. This paper presents the sensitivity evaluation of dual-wavelength image-plane digital holography in order to identify these different degrees of pile-up. It was observed that the interferometer was able to identify pile-up with a height of 3μm. Additionally, this result showed a good concordance with the measurement of the same part by using a Focus-Variation Microscope (FVM). Considering the application for in-situ measurements, corrections to deal with the misalignment between the interferometer and the evaluated surface was proposed and tested. Results showed that the setup is able to work with misalignments, which will produce up to 13 fringes in the measured phase.
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Matias R. Viotti, Armando Albertazzi Jr., Denis Boing, and Rodrigo Blödorn "Sensitivity of an image-plane digital holography interferometer for the measurement of pile-up", Proc. SPIE 11056, Optical Measurement Systems for Industrial Inspection XI, 1105649 (21 June 2019); https://doi.org/10.1117/12.2526002
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