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8 July 2019 Preparation of silica thin film by hot pressing process for passive radiative cooling
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Proceedings Volume 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019); 1106404 (2019) https://doi.org/10.1117/12.2539200
Event: Pacific Rim Laser Damage 2019 and Thin Film Physics and Applications 2019, 2019, Qingdao, China
Abstract
Thin films have been widely used, and their preparation methods are varied. In this paper, a new type of hot pressing process is introduced to fabricate silicon dioxide thin films based on PET. The thickness of the prepared silica film is up to 40 microns, and the film is transparent. The SiO2 thin films were deposited uniformly on Polyethylene terephthalate (PET) without obvious cracks, and the films could also be crimped. The prepared silicon dioxide films have the ability of passive radiative cooling, that is, the temperature of the films can reduce to lower than that of the ambient air. It can be expected that this method is also suitable for the preparation of other thin films.
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Zhenfei Zhang, Dengwu Liu, and Zhilin Xia "Preparation of silica thin film by hot pressing process for passive radiative cooling", Proc. SPIE 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019), 1106404 (8 July 2019); https://doi.org/10.1117/12.2539200
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