Paper
16 July 2019 Anomaly detection of solder joint on print circuit board by using Adversarial Autoencoder
Author Affiliations +
Proceedings Volume 11172, Fourteenth International Conference on Quality Control by Artificial Vision; 111720T (2019) https://doi.org/10.1117/12.2521762
Event: Fourteenth International Conference on Quality Control by Artificial Vision, 2019, Mulhouse, France
Abstract
We propose a defect detection method of solders on a printed circuit board using X-ray CT inspection system and Adversarial Autoencoder (AAE)[1] . We obtain sliced images of the solder using X-ray CT and extract their features that follow the standard normal distribution by using AAE. Then, the solder defects are detected by Hotelling's T square[2]. As a result of experiments, we show that we can classify normal and anomalous data samples completely on the condition of training with large normal samples and small anomalous samples.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Keisuke Goto, Kunihito Kato, Shunsuke Nakatsuka, Takaho Saito, and Hiroaki Aizawa "Anomaly detection of solder joint on print circuit board by using Adversarial Autoencoder", Proc. SPIE 11172, Fourteenth International Conference on Quality Control by Artificial Vision, 111720T (16 July 2019); https://doi.org/10.1117/12.2521762
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Cited by 3 scholarly publications.
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KEYWORDS
Statistical analysis

Computer programming

Inspection

Feature extraction

X-ray computed tomography

X-rays

Defect detection

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