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15 November 2019 A method to discriminate between upper and lower side material removal in double-side polishing
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Proceedings Volume 11175, Optifab 2019; 1117506 (2019) https://doi.org/10.1117/12.2536771
Event: SPIE Optifab, 2019, Rochester, New York, United States
Abstract
In this work, we propose a method to discriminate between upper and lower side material removal during double side polishing of fused silica parts. It consists in engraving cone-shaped craters on the two sides, then measuring the profile of each crater before/after a polishing run. The comparison of the profiles leads to the thickness removed on each side during the run. The craters have been engraved using a CO2 laser and their profiles measured thanks to a nano-scratcher. We have evaluated that this method can determine material removal with an accuracy of about 1μm, is insensitive to a part repositioning error under the tip of about 35μm, and has a repeatability of 0.5μm. Finally, we have been able to measure effective removal differences of 2μm between the two sides.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Maunier, M. Redien, B. Da Costa Fernandes, and J. Neauport "A method to discriminate between upper and lower side material removal in double-side polishing", Proc. SPIE 11175, Optifab 2019, 1117506 (15 November 2019); https://doi.org/10.1117/12.2536771
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