|
The mechanical architecture of such advanced digital processor is based on input/output routing channel modules and switch modules interconnected together thanks to optical interconnect technology already implemented in a breadboard developed under the ESTEC contract Optical Inter-board Interconnects for High Throughput on-Board Processors (OI2) but showing higher performances requested by the application. The optical interconnect is supported by optical transceiver, by optical connectors for inside and outside equipment interconnects, by optical cables and flexes. This optical interconnect solution is scalable to an overall throughput in excess of 15 Terabit/s with 150’s of optical links. In the frame of this development, Thales Alenia Space has identified and tested 3 different optical transceivers working at high speed data rate higher than 10 Gbps, compatible with GEO and LEO environment whose reliability is compatible with a lifetime of 15 years. The paper will present in detail the tests on selected transceiver (radiation behaviour and temperature) as well as the overall architecture of such advanced digital on board processing equipment. |
CITATIONS
Cited by 2 scholarly publications.
Eye
Manufacturing
Optical interconnects
Optoelectronics
Transceivers
Satellites
Optics manufacturing
