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16 October 2019 3D optical measuring and data processing applied in flexible electronics manufacturing
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Proceedings Volume 11205, Seventh International Conference on Optical and Photonic Engineering (icOPEN 2019); 112050M (2019) https://doi.org/10.1117/12.2542246
Event: Seventh International Conference on Optical and Photonic Engineering (icOPEN 2019), 2019, Phuket, Thailand
Abstract
Flexible-electronics is gaining increasing popularity in microelectronics such as flexible display, smart skin, epidermal electronics and soft robotics due to cost-effective fabrication and possibility of obtaining multifunctional electronics over large areas. Distinct from conventional microelectronics, flexible curved substrate such as polyimide has been adopted in the flexible-electronics manufacturing process. Hence, how to measure the curved surfaces of the substrates in a precise and fast way has become a key issue. Traditionally, the curved surfaces are usually measured in a coordinate measuring machine (CMM). However, the polyimide substrates (<1mm) are so thin that they are vulnerable to be scratched and deformed. To solve the problem, this paper presents a 3D measuring system based on the laser displacement sensor, high precision motion platform and programmable multi-axis controller (PMAC). Meanwhile, to process the measured data and inspect the machining quality of the substrate by using the 3D matching methods, a software called iPoint3D was developed.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fuquan Jin, Sheng Feng, Yong-an Huang, and Wenlong Li "3D optical measuring and data processing applied in flexible electronics manufacturing", Proc. SPIE 11205, Seventh International Conference on Optical and Photonic Engineering (icOPEN 2019), 112050M (16 October 2019); https://doi.org/10.1117/12.2542246
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