Translator Disclaimer
9 March 2020 Advanced laser material processing of steel and silicon (Conference Presentation)
Author Affiliations +
A main field of application for USP lasers is the fabrication of high-precision microstructures by ablation of bulk material. In the last 10 years, the output power of USP laser systems increased from around 10 W to several 100 W. This enables the increase of productivity of USP laser ablation processes by more than one order of magnitude. So far there is a leak of appropriate strategies and optical system to overcome limits based on heat accumulation. In this contribution, ablation strategies for steel and silicon by using far more than 100 W is deduced and presented.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Kiedrowski "Advanced laser material processing of steel and silicon (Conference Presentation)", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 1126705 (9 March 2020);

Back to Top