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9 March 2020 Single and dual wavelength double fs-pulse laser irradiation for transparent material processing (Conference Presentation)
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Abstract
Ultrafast laser glass processing is highly interesting for microelectronics and consumer electronics industries. Indeed, ultrafast laser technology has the unique capacity to produce a high-quality surface or bulk modification in dielectric transparent materials thank to nonlinear absorption. However, there is a need to improve both processing quality and throughput in order to meet the industry requirements. Beam shaping, performed by tuning spatial or temporal intensity profile, polarization, fluence, or any other laser parameters, is a smart and flexible technique to achieve this goal. This work is dealing with double fs-pulse laser irradiation of fused silica. Our purpose is to investigate the benefits and the drawbacks in using single and dual-wavelength double fs-pulse laser irradiation of fused silica. The influence of pulse-to-pulse delay (0 to 5 ps), pulse duration of the second pulse (1 ps to 25 ns) and fluence on both removal rate and optical transmission will be discussed.
Conference Presentation
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John Lopez, Kevin Gaudfrin, Konstantin Mishchik, Martin Delaigue, Clemens Hönninger, Eric Audouard, Rainer Kling, and Guillaume Duchateau "Single and dual wavelength double fs-pulse laser irradiation for transparent material processing (Conference Presentation)", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 1126716 (9 March 2020); https://doi.org/10.1117/12.2544323
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