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9 March 2020 Low-power reconfigurable photonic integrated circuits fabricated by femtosecond laser micromachining (Conference Presentation)
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Abstract
Femtosecond laser micromachining (FLM) is considered today a key technology for the fabrication of high-quality photonic integrated circuits, especially when a 3D geometry is required. However, when a thermal phase shifter is exploited to reconfigure an FLM device, its operation requires many hundreds of milliwatts. This issue strongly limits the scalability of these circuits. With this work, we present a new FLM fabrication process that takes advantage of thermally insulating microstructures (i.e. trenches and bridge waveguides) to demonstrate low propagation losses (0.29 dB/cm at 1550 nm), along with a power dissipation for a 2π phase shift down to 37 mW.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Francesco Ceccarelli, Simone Atzeni, Francesco Pellegatta, Simone Piacentini, Andrea Crespi, and Roberto Osellame "Low-power reconfigurable photonic integrated circuits fabricated by femtosecond laser micromachining (Conference Presentation)", Proc. SPIE 11270, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XX, 112700U (9 March 2020); https://doi.org/10.1117/12.2544669
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