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2 March 2020 Process development for laser powder bed fusion of pure copper
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Proceedings Volume 11271, Laser 3D Manufacturing VII; 112710I (2020) https://doi.org/10.1117/12.2563870
Event: SPIE LASE, 2020, San Francisco, California, United States
Abstract
This paper describes the development of suitable process parameters to ensure a reproducible, defect-free production of pure copper specimen via Laser Powder Bed Fusion (LPBF) also called Selective Laser Melting (SLM). Therefore, a set of experiments was developed and evaluated in a Design of Experiment (DoE) which finally provide an indication about ideal process parameters for melting pure copper powder at a wavelength of 1064 nm. For the experiments Cu-ETP with a copper purity of more than 99.90 % was processed with a laser power of up to 500 W resulting in a maximum density of 99.82 % and an electrical conductivity of 56.88 MS/m. Besides the development of optimal parameter combinations of laser power, laser speed and hatching distance, focusing the laser beam to a spot diameter of about 35 μm with a fused silica f-theta lens and thus high energy intensities of about 416 kW/mm2 resulted in best materials properties.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Stoll, Pascal Trautnitz, Samuel Schmiedeke, Joerg Franke, and Nahum Travitzky "Process development for laser powder bed fusion of pure copper", Proc. SPIE 11271, Laser 3D Manufacturing VII, 112710I (2 March 2020); https://doi.org/10.1117/12.2563870
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