High peak power DUV laser processing

Yasuhiro Kamba; Hironori Igarashi; Takashi Onose; Taisuke Miura; Ryoichi Nohdomi; Hiroaki Oizumi; Yoshihiko Murakami; Atsushi Fuchimukai; Chen Qu; Yuki Tamaru; Yohei Tanaka; Yuujirou Sasaki; Junichi Fujimoto; Hakaru Mizoguchi

doi:10.1117/12.2549826

2 March 2020 High peak power DUV laser processing

Yasuhiro Kamba, Hironori Igarashi, Takashi Onose, Taisuke Miura, Ryoichi Nohdomi, Hiroaki Oizumi, Yoshihiko Murakami, Atsushi Fuchimukai, Chen Qu, Yuki Tamaru, Yohei Tanaka, Yuujirou Sasaki, Junichi Fujimoto, Hakaru Mizoguchi

Author Affiliations +

Proceedings Volume 11273, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems IX; 112730L (2020) https://doi.org/10.1117/12.2549826
Event: SPIE LASE, 2020, San Francisco, California, United States

Abstract

Deep ultra-violet (DUV) laser and short pulse lasers are used for laser processing, because they can decrease the heat effect for process materials. We are developing a hybrid ArF excimer laser that is consists of a solid-state laser, multi wavelength conversion and ArF excimer amplifier. This laser can generate DUV light of 193 nm wavelength short pulse width. In this research, we demonstrated laser drilling on ultra-high temperature structural material that is silicon carbide ceramic matrix composites (SiC-CMC) using high peak power DUV laser. The removal rate was 150 nm/shot with 460 ps pulse. This rate was more than 4 times higher than ArF excimer laser (20 ns pulse width). The HAZ was also reduced by using high peak power DUV light source.

Citation Download Citation

Yasuhiro Kamba, Hironori Igarashi, Takashi Onose, Taisuke Miura, Ryoichi Nohdomi, Hiroaki Oizumi, Yoshihiko Murakami, Atsushi Fuchimukai, Chen Qu, Yuki Tamaru, Yohei Tanaka, Yuujirou Sasaki, Junichi Fujimoto, and Hakaru Mizoguchi "High peak power DUV laser processing", Proc. SPIE 11273, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems IX, 112730L (2 March 2020); https://doi.org/10.1117/12.2549826

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