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28 February 2020 Bridging the gap: manufacturing optical transceivers in the multibillion-dollar silicon electronics supply chain
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Proceedings Volume 11286, Optical Interconnects XX; 112860H (2020) https://doi.org/10.1117/12.2550937
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
Juniper’s silicon photonics technology employs an entirely new approach to optics manufacturing that leverages design, wafer manufacturing, packaging and test infrastructure and methodologies from the microelectronics ecosystem, resulting in a fabless optical transceiver manufacturing flow cable of scaling, in both cost and performance, with the needs of the networking industry. Juniper’s fully integrated “Opto-ASIC” transceiver leverages densely packaged electronic and photonic die in a single, low-cost package that supports common module form factors as well as on-board and on-package optics applications. The ability to incorporate all optical components, including lasers, within a single, common silicon die is a key enabler of the approach, fundamentally changing and simplifying how an optical transceiver can be assembled and tested. We will review lessons learned and provide a preview of the road ahead.
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© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Theodore J. Schmidt and Roberto R. Marcoccia "Bridging the gap: manufacturing optical transceivers in the multibillion-dollar silicon electronics supply chain", Proc. SPIE 11286, Optical Interconnects XX, 112860H (28 February 2020); https://doi.org/10.1117/12.2550937
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