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9 March 2020 High-density optical module for on-board optical interconnects utilizing graded-index core polymer waveguide (Conference Presentation)
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Proceedings Volume 11286, Optical Interconnects XX; 112860J (2020) https://doi.org/10.1117/12.2544341
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
Recently, with the increasing traffic in data centers (DCs) and the evolution of high-performance computers (HPCs), large-capacity data transmission has been required in DC and HPC networks. To take advantage of optical interconnects with the capability of transmitting high-speed signals under high wiring density, we have proposed active optical modules for inter-rack interconnects in DC and HPC networks. In order to satisfy the higher bandwidth demand, not only the inter-rack interconnects but also on-board interconnects are required to have a high density. In this paper, we propose a high-density optical module utilizing graded-index (GI) polymer waveguide for on-board optical interconnects.
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© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Naohiro Kohmu, Maho Ishii, and Takaaki Ishigure "High-density optical module for on-board optical interconnects utilizing graded-index core polymer waveguide (Conference Presentation)", Proc. SPIE 11286, Optical Interconnects XX, 112860J (9 March 2020); https://doi.org/10.1117/12.2544341
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