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28 February 2020 Short reach, low cost silicon photonic micro-transceivers for embedded and co-packaged system integration
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Proceedings Volume 11286, Optical Interconnects XX; 112860R (2020) https://doi.org/10.1117/12.2546626
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
We report on the design and performance of a compact, low power, micro-transceiver chip suitable for high volume, long life deployment in high temperature (>100°C) environments. The I/O Core micro-transceiver comprises a 5mm x 5mm silicon photonics chip with a multimode interface and incorporates 4 transmit and 4 receiver channels operating at 25 Gb/s in the O-band. We will demonstrate how the I/O Core micro-transceiver may be deployed in a wide variety of packages and applications spaces including data centers, HPCs, 5G, AI and automotive systems.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kazuhiko Kurata and Richard Pitwon "Short reach, low cost silicon photonic micro-transceivers for embedded and co-packaged system integration", Proc. SPIE 11286, Optical Interconnects XX, 112860R (28 February 2020); https://doi.org/10.1117/12.2546626
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