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10 March 2020 The hybrid III-V on Si photonic platform revisited: achievements and challenges (Conference Presentation)
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Abstract
On-chip optical communications have experienced great progress lately, gaining in maturity with fast, reliable and efficient optical interconnects. Silicon photonics has demonstrated huge potential to become the dominant technology to support this development. Still, the silicon photonics lacks of a monolithic light source. To overcome this blocking point, hybrid integration of III-V materials on silicon raises as a viable route in the short term. In this work, we will revisit the hybrid III-V on Si platform and put forward our particular vision at the III-V lab, discussing several points that will play a key role in the coming years.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joan Manel Ramírez, Hajar Elfaiki, Théo Vérolet, Claire Besançon, Delphine Néel, Karim Hassan, Christophe Jany, Stéphane Malhouitre, Alexandre Shen, Christophe Caillaud, Dalila Make, Harry Garriah, Jean Decobert, and Mohand Achouche "The hybrid III-V on Si photonic platform revisited: achievements and challenges (Conference Presentation)", Proc. SPIE 11288, Quantum Sensing and Nano Electronics and Photonics XVII, 112881G (10 March 2020); https://doi.org/10.1117/12.2545630
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