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23 March 2020 Integrating enhanced hotspot library into manufacturing OPC correction flow
Bradley J. Falch, Linghui Wu, John Tsai, Elsley Tan, Jiunhau Fu, Tengyen Huang, Chuncheng Liao
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Proceedings Volume 11328, Design-Process-Technology Co-optimization for Manufacturability XIV; 113280E (2020) https://doi.org/10.1117/12.2552110
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States
Abstract
As feature sizes diminish and correction flow complexity increases, it becomes extremely difficult to create homogeneous mask synthesis correction recipes that can pass lithographic verification without some failing hotspots. When encountered in the production line, these areas are frequently fixed quickly so the tapeout can resume and time-tomask is preserved as much as possible. However, these hotspots may occur in future designs, so it is beneficial to update the standard correction recipe with this hotspot information and avoid verification failures before they occur. This paper examines inserting unique hotspot corrections into the standard correction flow using pattern matching to identify the hotspot areas. Standard correction recipes can be updated to accept these hotspot areas and adjust recipe parameters or correction techniques in a standard manner so that these hotspots will be fixed automatically. This automation technique minimizes human interaction with the recipe.
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Bradley J. Falch, Linghui Wu, John Tsai, Elsley Tan, Jiunhau Fu, Tengyen Huang, and Chuncheng Liao "Integrating enhanced hotspot library into manufacturing OPC correction flow", Proc. SPIE 11328, Design-Process-Technology Co-optimization for Manufacturability XIV, 113280E (23 March 2020); https://doi.org/10.1117/12.2552110
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KEYWORDS
Optical proximity correction
Lithography
Associative arrays
Photomasks
Manufacturing
Metals
Semiconductors
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