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1 May 2020 Front Matter: Volume 11329
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This PDF file contains the front matter associated with SPIE Proceedings Volume 11329, including the Title Page, Copyright Information, Table of Contents, Author and Conference Committee lists.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from these proceedings:

Author(s), “Title of Paper,” in Advanced Etch Technology for Nanopatterning IX, edited by Richard S. Wise, Catherine B. Labelle, Proceedings of SPIE Vol. 11329 (SPIE, Bellingham, WA, 2020) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510634251

ISBN: 9781510634268 (electronic)

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Paper Numbering: Proceedings of SPIE follow an e-First publication model. A unique citation identifier (CID) number is assigned to each article at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Authors

Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Altamirano-Sanchez, E., 0O

Baclet, Stephanie, 0I

Baderot, J., 0X

Ban, Yang, 0Z

Barnola, Sébastien, 0V

Biolsi, Peter, 0T

Bonnecaze, Roger T., 0C, 0Z

Bruce, R. L., 0S

Bryan, M., 0X

Buzi, L., 0S

Cao, Liang, 09

Chan, B. T., 0O

Chopra, Meghali C., 0C, 0Z

Chopra, Sonali, 0Z

Clement, N., 0X

Cooke, Mike, 0I

Cunge, Gilles, 0V

Darbon, B., 0X

Dineen, Mark, 0I

Dupuy, E., 0O

Engelmann, S. U., 0S

Fenger, Germain, 09

Feurprier, Yannick, 10

Foucher, J., 0X

Goodyear, Andy, 0I

Gouraud, Pascal, 0V

Hemakumara, Tania, 0I

Hermans, Jan, 10

Hisamatsu, Toru, 05

Honda, Masanobu, 05

Hong, Le, 09

Hopstaken, M., 0S

Jayaram, Srividya, 09

Jenny, Cécile, 0G

Jiang, Fan, 09

Katsunuma, Takayuki, 05

Kearney, Kara, 0Z

Khojasteh, M. M., 0S

Kihara, Yoshihide, 05

Kim, YoungChang, 09

Ko, Akiteru, 0T

Kumakura, Sho, 05

Kumar, Kaushik, 10

Kwak, Doohwan, 09

Lazzarino, F., 0O

Liubich, Vlad, 09

Loubet, Nicolas Alexandre, 0G

Loveday, Matthew, 0I

Ma, Yuansheng, 09

Martinez, S., 0X

Medina, Leandro, 0C

Mellmann, Joerg, 09

Melvin, Lawrence, 0H

Metz, Andrew, 0T

Metzler, Dominik, 0H

Miyazoe, H., 0S

Molis, S., 0S

Mouraille, Orion, 10

Mukesh, Sagarika, 0H

Newton, Andrew, 0I

Oulmane, Mohamed, 0H

Papalia, J. M., 0S

Pargon, Erwine, 0G

Petit-Etienne, Camille, 0G, 0V

Philippi, Caitlin, 0T

Raghunathan, Ananthan, 09

Raley, Angélique, 0T

Stopford, Phil, 0H

Sundahl, Bryan, 0C

Tao, Z., 0O

Thibaut, Sophie, 0T

van Dijk, Leon, 10

van Haren, Richard, 10

Ward, Craig, 0I

Word, James, 09

Yildirim, Oktay, 10

Yogendra, Karthik, 0H

Younesy, Salma, 0V

Zhang, L., 0O

Zhu, Xilan, 0Z

Conference Committee

Symposium Chairs

  • Will Conley, Cymer, an ASML Company (United States)

  • Kafai Lai, IBM Thomas J. Watson Research Center (United States)

Conference Chair

  • Richard S. Wise, Lam Research Corporation (United States)

Conference Co-chair

  • Catherine B. Labelle, Intel Corporation (United States)

Conference Program Committee

  • Efrain Altamirano-Sánchez, IMEC (Belgium)

  • John Arnold, IBM Thomas J. Watson Research Center (United States)

  • Keun Hee Bai, SAMSUNG Electronics Company, Ltd. (Korea, Republic of)

  • Julie Bannister, Tokyo Electron America, Inc. (United States)

  • Maxime Darnon, LN2 CNRS (Canada)

  • Sebastian U. Engelmann, IBM Thomas J. Watson Research Center (United States)

  • Eric A. Hudson, Lam Research Corporation (United States)

  • Kaushik A. Kumar, Tokyo Electron Ltd. (Japan)

  • Qinghuang Lin, ASML US, Inc. (United States)

  • Ru-Gun Liu, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

  • Nihar Mohanty, Oculus VR, LLC (United States)

  • Jake O'Gorman, Hitachi High Technologies America, Inc. (United States)

  • Erwine Pargon, CNRS/LTM (France)

  • Nicolas Posseme, CEA-LETI (France)

  • Ricardo Ruiz, Lawrence Berkeley National Laboratory (United States)

  • Yuyang Sun, Mentor Graphics Corporation (United States)

  • Ying Zhang, NAURA (United States)

  • Anthony Yen, ASML US, LP (United States)

Session Chairs

  • 1 Keynote Session

    Catherine B. Labelle, Intel Corporation (United States)

    Julie Bannister, Tokyo Electron America, Inc. (United States)

  • 2 Materials and Etch Integration

    Eric A. Hudson, Lam Research Corporation (United States)

    Efrain Altamirano-Sánchez, imec (Belgium)

  • 3 Computational Patterning and Patterning Process Control

    Yuyang Sun, Mentor, a Siemens Business (United States)

    Qinghuang Lin, ASML US, Inc. (United States)

  • 4 Atomic Layer Etching and Novel Plasma Techniques

    Jake O'Gorman, Hitachi High Technologies America, Inc. (United States)

  • 5 EUV Patterning and Etch: Joint session with conferences 11323 and 11329

    Yuyang Sun, Mentor, a Siemens Business (United States)

    John Arnold, IBM Thomas J. Watson Research Center (United States)

    Allen H. Gabor, IBM Thomas J. Watson Research Center (United States)

  • 6 Patterning Solutions for Emerging Applications

    Nihar Mohanty, Facebook Technologies, LLC (United States)

    Ricardo Ruiz, Lawrence Berkeley National Laboratory (United States)

  • 7 Advanced Patterning Integration

    Ying Zhang, Applied Materials, Inc. (United States)

© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 11329", Proc. SPIE 11329, Advanced Etch Technology for Nanopatterning IX, 1132901 (1 May 2020); https://doi.org/10.1117/12.2571137
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