Translator Disclaimer
Paper
18 December 2019 Mechanism of crack propagation in chemical treatment process of microchannel plate
Author Affiliations +
Proceedings Volume 11338, AOPC 2019: Optical Sensing and Imaging Technology; 113382R (2019) https://doi.org/10.1117/12.2547766
Event: Applied Optics and Photonics China (AOPC2019), 2019, Beijing, China
Abstract
Crack in microchannel plate (MCP) seriously reduces the mechanical and electrical properties of MCP. The mechanism of crack propagation in the chemical treatment process was revealed by studying the changes of crack morphology in acid-alkali etching and hydrogen reduction. The results show that during the acid-alkali etching process, the cracks on the channel material is dissolved by the dilute HNO3 and the cracks on the channel wall expands gradually under the etching of the NaOH solution. During the reduction process, cracks do not change significantly at the stage of heating. While at the stage of reaction with H2,the cracks are more easily expanded. The length of cracks does not change significantly after reduction. However, the surface near the cracks warps and the depth of cracks increases.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jinsheng Jia, Jiao Lian, Xian Zhang, Lei Zhang, Sanzhao Wang, Puguang Song, Haoyang Yu, and Zhiheng Fan "Mechanism of crack propagation in chemical treatment process of microchannel plate", Proc. SPIE 11338, AOPC 2019: Optical Sensing and Imaging Technology, 113382R (18 December 2019); https://doi.org/10.1117/12.2547766
PROCEEDINGS
7 PAGES


SHARE
Advertisement
Advertisement
Back to Top