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13 November 2019 Parameter calibration of surface profile measurement system based on femtosecond laser
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Proceedings Volume 11343, Ninth International Symposium on Precision Mechanical Measurements; 113430I (2019) https://doi.org/10.1117/12.2547772
Event: International Symposium on Precision Mechanical Measurements 2019, 2019, Chongqing, China
Abstract
Based on femtosecond laser scanning interference, this paper dedicated to the surface profile measurement of silicon wafers. Femtosecond laser has not only low time coherence, but also high spatial coherence and high measurement accuracy. This measurement system is on the basis of a Michelson interferometer. Stepping motor is used to move the measuring arm so as to scan the surface of the measuring object. Then, the reconstruction of the object’s surface profile is accomplished by the algorithm. We use a short-wave infrared camera to record the interference fringes. The surface profile is reconstructed with pixel points, so the pixel size of the camera is the key to the reconstruction. In this paper, a standard part is selected and measured, then the camera pixel is calibrated through the size of the standard part. In this paper, the grating is tested as a standard part, and the camera pixel is calibrated through the grating reticle. Finally, the surface profile of the silicon wafer was measured with the calibrated system.
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Jie Cheng, Yaqi Chang, Haoran Gao, Dian Bian, and Liandong Yu "Parameter calibration of surface profile measurement system based on femtosecond laser", Proc. SPIE 11343, Ninth International Symposium on Precision Mechanical Measurements, 113430I (13 November 2019); https://doi.org/10.1117/12.2547772
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