11 October 1989 Concept Of Buried Mask And Its Realisation
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Proceedings Volume 1138, Optical Microlithography and Metrology for Microcircuit Fabrication; (1989) https://doi.org/10.1117/12.961752
Event: 1989 International Congress on Optical Science and Engineering, 1989, Paris, France
A new method for fabricating photomasks is proposed. The mask is prepared by burying the absorbent patterns inside the transparent photoplate instead of depositing them on the surface of the photoplate. After imaging and etching trenches into the glass substrate, an absorbent material is set into them. Two different ways of filling in these holes are considered: planarisation and lift-off. Various advantages of this technique are expected, namely high resolution. This paper presents results obtained by vacuum contact printing of positive and negative novolak based photoresists exposed through buried masks.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. P. Panabiere, J. P. Panabiere, J. M. Francou, J. M. Francou, A. Weill, A. Weill, L. Guerin, L. Guerin, P. Moschini, P. Moschini, M. Pons, M. Pons, A. Inard, A. Inard, G. Amblard, G. Amblard, } "Concept Of Buried Mask And Its Realisation", Proc. SPIE 1138, Optical Microlithography and Metrology for Microcircuit Fabrication, (11 October 1989); doi: 10.1117/12.961752; https://doi.org/10.1117/12.961752


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