The present status of the understanding and control of InP and InGaAs insulator-semiconductor(I-S) interfaces is discussed for surface passivation and and MISFET fabrication. The electrical and microstructural properties of. I-S interfaces are reviewed, and the existing models concerning the origin of interface states are compared. Then, based on the DIGS model by the author's group, control of I-S interface through introduction of two types of interface control layer(ICL) is discussed. One is an anodic native oxide layer, and the other is an MBE-grown ultrathin pseudomorphic Si layer, both combined with a thick photo-CVD insulator. Both 1CLs lead to significant improvements in Nss, channel mobility and drain current stability.
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