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11 September 2020 Investigation of shock waves during ultrashort pulse laser drilling of SiC by combining pump-probe imaging with high-speed camera
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Abstract
Recently, ultrashort pulse laser processing has been attracting attention as a method for micro-processing Silicon-Carbide (SiC). However, there is a severe problem with this technique: cracks formed around the processed shape hinder precision processing. In this study, to reveal the mechanism of crack formation during the ultrashort pulse laser processing of SiC, we investigated the high-speed phenomena happening during processing. The results showed that the shock waves propagated inside the material every time the pump pulse was focused on the substrate. In conclusion, the present study demonstrated the mechanism of damage formation during the ultrashort pulse laser processing of SiC.
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© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Junya Hattori, Yusuke Ito, Keisuke Nagato, and Naohiko Sugita "Investigation of shock waves during ultrashort pulse laser drilling of SiC by combining pump-probe imaging with high-speed camera", Proc. SPIE 11514, Laser-induced Damage in Optical Materials 2020, 115141R (11 September 2020); https://doi.org/10.1117/12.2570971
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