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22 February 2021 DSA process optimization for high volume manufacturing
Makoto Muramatsu, Takanori Nishi, Yasuyuki Ido, Takahiro Kitano
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Proceedings Volume 11610, Novel Patterning Technologies 2021; 116100N (2021) https://doi.org/10.1117/12.2584946
Event: SPIE Advanced Lithography, 2021, Online Only
Abstract
Direct Self-Assembly (DSA) is expected to be applied to patterns below 20 nm, and many applications have been proposed along with several lithography techniques. The advantage of DSA is that the molecular weight of the polymer can control the pattern size and achieve a fixed pattern pitch. On the other hand, the DSA process faces the technical challenges of pattern defects, line edge roughness (LER), and pattern transfer to the underlying layer. Tokyo Electron has reported the results of these improvements in the past SPIE. This report introduces each optimization method and shows you the next steps.
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Makoto Muramatsu, Takanori Nishi, Yasuyuki Ido, and Takahiro Kitano "DSA process optimization for high volume manufacturing", Proc. SPIE 11610, Novel Patterning Technologies 2021, 116100N (22 February 2021); https://doi.org/10.1117/12.2584946
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KEYWORDS
Directed self assembly
High volume manufacturing
Line edge roughness
Lithography
Molecular self-assembly
Polymers
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