Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology

Tsuyoshi Kondo; Naoma Ban; Yasushi Ebizuka; Yasutaka Toyoda; Yukari Yamada; Taeko Kashiwa; Hirohito Koike; Hiroyuki Shindo; Anne-Laure Charley; Mohamed Saib; Frieda Van Roey; Peter De Bisschop; Danilo De Simone; Christophe Beral; Gian F. Lorusso

doi:10.1117/12.2583691

22 February 2021 Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology

Tsuyoshi Kondo, Naoma Ban, Yasushi Ebizuka, Yasutaka Toyoda, Yukari Yamada, Taeko Kashiwa, Hirohito Koike, Hiroyuki Shindo, Anne-Laure Charley, Mohamed Saib, Frieda Van Roey, Peter De Bisschop, Danilo De Simone, Christophe Beral, Gian F. Lorusso

Author Affiliations +

Proceedings Volume 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV; 1161111 (2021) https://doi.org/10.1117/12.2583691
Event: SPIE Advanced Lithography, 2021, Online Only

Abstract

As the development of Extreme Ultraviolet Lithography (EUVL) is progressing toward the sub-10nm generation, the process window becomes very tight. In this situation, local Critical Dimension (CD) variability including stochastic defect directly affects the yield loss, and it is very important to inspect/measure all patterning area of interest on chip for the process verification. In this paper, by combining Area Inspection SEM (AI-SEM) with large Field Of View (FOV) and Die-to-Database-base (D2DB) technologies, we show a comprehensive solution for fast inspection and precise massive CD measurement of EUV characterized features, such as After Development Inspection (ADI) hole pattern, and aperiodic 2D Logic pattern. Also, a big data analysis consisting of multiple CD indices output by AI-SEM, a new process window by multivariable analysis is discussed. Furthermore, Machine Learning (ML) -based inspection and metrology to maximize imaging speed, is also reported.

Conference Presentation

Citation Download Citation

Tsuyoshi Kondo, Naoma Ban, Yasushi Ebizuka, Yasutaka Toyoda, Yukari Yamada, Taeko Kashiwa, Hirohito Koike, Hiroyuki Shindo, Anne-Laure Charley, Mohamed Saib, Frieda Van Roey, Peter De Bisschop, Danilo De Simone, Christophe Beral, and Gian F. Lorusso "Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology", Proc. SPIE 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 1161111 (22 February 2021); https://doi.org/10.1117/12.2583691

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available